Electromigration investigations of aluminum alloy interconnects

Authors

B. Setlik, University of Rhode Island
D. Heskett, University of Rhode Island
K. Aubin, University of Rhode Island
M. A. Briere, University of Rhode Island

Document Type

Conference Proceeding

Date of Original Version

12-1-1997

Abstract

Electrical measurements of test structures of Al-0.5%Cu interconnects were performed as a function of temperature and current density. We have examined 1.8 μm wide×0.85 μm thick×250 μm long straight structures and found an activation energy, Ea = 0.95 eV and a current exponent, n = 2.63, after correction for Joule heating.

Publication Title, e.g., Journal

Biennial University/Government/Industry Microelectronics Symposium - Proceedings

Citation/Publisher Attribution

Setlik, B., D. Heskett, K. Aubin, and M. A. Briere. "Electromigration investigations of aluminum alloy interconnects." Biennial University/Government/Industry Microelectronics Symposium - Proceedings (1997): 159-160. https://digitalcommons.uri.edu/phys_facpubs/359