An optical microscopy imaging method for detection of electromigration-induced damage

Document Type

Article

Date of Original Version

9-1-2004

Abstract

Electromigration damage is a microscopic phenomenon involving electric field-induced diffusion, which is very relevant to damage in interconnects. Recently, we have developed a novel and useful optical microscopy method with which we can visually observe and record such damage formation during an accelerated stress test. This new non-contact technique provides complementary information to the more traditional probe of electrical resistance. © 2004 Elsevier B.V. All rights reserved.

Publication Title, e.g., Journal

Microelectronic Engineering

Volume

75

Issue

3

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