Optical microscopy imaging method for detection of electromigration: Theory and experiment
Document Type
Article
Date of Original Version
5-1-2007
Abstract
Electromigration is a microscopic phenomenon involving electric field-induced diffusion, which is very relevant to damage in interconnects. A common method to monitor interconnect degradation is through electrical resistance measurements, which requires direct electrical contacts. It is desirable to develop non-contact methods to monitor electromigration damage formation. Recently, we have proposed a novel Optical Microscopy Imaging Method (OMIM). Here we provide theoretical proof and additional experimental results. OMIM provides a new method for studying electromigration-induced damage. © 2007 WILEY-VCH Verlag GmbH & Co. KGaA.
Publication Title, e.g., Journal
Physica Status Solidi (A) Applications and Materials Science
Volume
204
Issue
5
Citation/Publisher Attribution
Li, L. H., V. Dasika, D. Heskett, and W. H. Tang. "Optical microscopy imaging method for detection of electromigration: Theory and experiment." Physica Status Solidi (A) Applications and Materials Science 204, 5 (2007): 1589-1595. doi: 10.1002/pssa.200622455.
