Optical microscopy imaging method for detection of electromigration: Theory and experiment

Document Type

Article

Date of Original Version

5-1-2007

Abstract

Electromigration is a microscopic phenomenon involving electric field-induced diffusion, which is very relevant to damage in interconnects. A common method to monitor interconnect degradation is through electrical resistance measurements, which requires direct electrical contacts. It is desirable to develop non-contact methods to monitor electromigration damage formation. Recently, we have proposed a novel Optical Microscopy Imaging Method (OMIM). Here we provide theoretical proof and additional experimental results. OMIM provides a new method for studying electromigration-induced damage. © 2007 WILEY-VCH Verlag GmbH & Co. KGaA.

Publication Title, e.g., Journal

Physica Status Solidi (A) Applications and Materials Science

Volume

204

Issue

5

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