Title

Subsonic and intersonic crack growth along a bimaterial interface

Document Type

Article

Date of Original Version

1-1-1996

Abstract

An experimental investigation has been conducted to study the dynamic failure of bimaterial interfaces. Interfacial crack growth is observed using dynamic photoelasticity and characterized in terms of crack-tip velocity, complex stress intensity factor, and energy release rate. On the basis of crack-tip velocity two growth regimes are established, viz. the subsonic and transonic regimes. In the latter regime crack-tip velocities up to 1.3 times the shear wave velocity of the more compliant material are observed. This results in the formation of a line of discontinuity in the stress field surrounding the crack tip and also the presence of a pseudo crack tip that travels with the Rayleigh wave velocity (of the more compliant material). © 1996 ASME.

Publication Title, e.g., Journal

Journal of Applied Mechanics, Transactions ASME

Volume

63

Issue

4

Link to Full Text
COinS