Subsonic and intersonic crack growth along a bimaterial interface
Document Type
Article
Date of Original Version
1-1-1996
Abstract
An experimental investigation has been conducted to study the dynamic failure of bimaterial interfaces. Interfacial crack growth is observed using dynamic photoelasticity and characterized in terms of crack-tip velocity, complex stress intensity factor, and energy release rate. On the basis of crack-tip velocity two growth regimes are established, viz. the subsonic and transonic regimes. In the latter regime crack-tip velocities up to 1.3 times the shear wave velocity of the more compliant material are observed. This results in the formation of a line of discontinuity in the stress field surrounding the crack tip and also the presence of a pseudo crack tip that travels with the Rayleigh wave velocity (of the more compliant material). © 1996 ASME.
Publication Title, e.g., Journal
Journal of Applied Mechanics, Transactions ASME
Volume
63
Issue
4
Citation/Publisher Attribution
Singh, R. P., and A. Shukla. "Subsonic and intersonic crack growth along a bimaterial interface." Journal of Applied Mechanics, Transactions ASME 63, 4 (1996): 919-924. doi: 10.1115/1.2787247.
