The Effect of Aging of Urea-Formaldehyde Foam On Thermal Conductance

Document Type

Article

Date of Original Version

1-1-1982

Abstract

The thermal conductance of vertical panels was measured over a period of months. Urea formaldehyde foam filled the cavities of the panels. The conductance was found to increase with aging. The cause of the increase is due to shrinking and cracking of the foam. The variation of shrinkage and conductance with time are discussed and quantified. © 1982, Sage Publications. All rights reserved.

Publication Title, e.g., Journal

Journal of Thermal Envelope and Building Science

Volume

6

Issue

1

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