Date of Original Version
A method to directly electrolessly plate silicon-rich silicon nitride with thin gold films was developed and characterized. Films with thicknesses <100nm were grown at 3 and 10°C between 0.5 and 3 hours, with mean grain sizes between ~20-30nm. The method is compatible with plating free-standing ultrathin silicon nitride membranes, and we successfully plated the interior walls of micropore arrays in 200nm-thick silicon nitride membranes. The method is thus amenable to coating planar, curved, and line-of-sight-obscured silicon nitride surfaces.
Whelan, J C., Karawdeniya, B. I., Nuwan, Y. M., Bandara, D. Y., Velleco, B. D., Masterson C. M., & Dwyer, J. R. (2014). Electroless Plating of Thin Gold Films Directly onto Silicon Nitride Thin Films and into Micropores. ACS Appl. Mater. Interfaces, 6(14), 10952–10957. doi: 10.1021/am501971n
Available at: http://dx.doi.org/10.1021/am501971n