Title

Electromigration investigations of aluminum alloy interconnects

Document Type

Conference Proceeding

Date of Original Version

12-1-1997

Abstract

Electrical measurements of test structures of Al-0.5%Cu interconnects were performed as a function of temperature and current density. We have examined 1.8 μm wide×0.85 μm thick×250 μm long straight structures and found an activation energy, Ea = 0.95 eV and a current exponent, n = 2.63, after correction for Joule heating.

Publication Title

Biennial University/Government/Industry Microelectronics Symposium - Proceedings

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