A mechanical reliability approach for the optimization of alternatives to tin-lead solder interconnection systems for electronic packaging

Author

Anthony Joseph Rafanelli, University of Rhode Island

Date of Award

1995

Degree Type

Dissertation

Degree Name

Doctor of Philosophy in Mechanical Engineering and Applied Mechanics

Comments

This dissertation was scanned from microfilm. To report any image quality issues, please contact the URI library at digitalcommons-group@uri.edu as we may be able to fix the problem. The copyright in this dissertation belongs to the author.

Recommended Citation

Rafanelli, Anthony Joseph, "A mechanical reliability approach for the optimization of alternatives to tin-lead solder interconnection systems for electronic packaging" (1995). Open Access Dissertations. Paper 4039.
https://digitalcommons.uri.edu/oa_diss/4039