Date of Award

2005

Degree Type

Dissertation

First Advisor

David Heskett

Abstract

Electromigration is a microscopic phenomenon involving electric field-induced diffusion, which is very relevant to damage in interconnects. A common method to monitor interconnect degradation is through electrical resistance measurements, which requires direct electrical contacts. It is desirable to develop non-contact methods to monitor electromigration damage formation. In this thesis, we propose a novel Optical Microscopy Imaging Method (OMIM), and we provide a theoretical description and experimental results. OMIM not only provides a new method for studying electromigration, but also provides a useful method for studying other micro-devices and materials in a non-contact mode.

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