Dynamic crack-tip stress and displacement fields under thermomechanical loading in functionally graded materials
Date of Original Version
Thermomechanical stress and displacement fields for a propagating crack in functionally graded materials (FGMs) are developed using displacement potentials and asymptotic analysis. The shear modulus, mass density, and coefficient of thermal expansion of the FGMs are assumed to vary exponentially along the gradation direction. Temperature and heat flux distribution fields are also derived for an exponential variation of thermal conductivity. The mode mixity due to mixed-mode loading conditions around the crack tip is accommodated in the analysis through the superposition of opening and shear modes. Using the asymptotic stress fields, the contours of isochromatics (contours of constant maximum shear stress) are developed and the results are discussed for various crack-tip thermomechanical loading conditions. Copyright © 2008 by ASME.
Journal of Applied Mechanics, Transactions ASME
Lee, Kwang Ho, Vijaya B. Chalivendra, and Arun Shukla. "Dynamic crack-tip stress and displacement fields under thermomechanical loading in functionally graded materials." Journal of Applied Mechanics, Transactions ASME 75, 5 (2008): 0511011-0511017. doi:10.1115/1.2932093.