The Effect of Aging of Urea-Formaldehyde Foam On Thermal Conductance
Date of Original Version
The thermal conductance of vertical panels was measured over a period of months. Urea formaldehyde foam filled the cavities of the panels. The conductance was found to increase with aging. The cause of the increase is due to shrinking and cracking of the foam. The variation of shrinkage and conductance with time are discussed and quantified. © 1982, Sage Publications. All rights reserved.
Journal of Thermal Envelope and Building Science
Kalthod, Vikram, and Harold N. Knickle. "The Effect of Aging of Urea-Formaldehyde Foam On Thermal Conductance." Journal of Thermal Envelope and Building Science 6, 1 (1982): 14-38. doi:10.1177/109719638200600102.