Title

Sub micron cleaning of microelectronics devices via vacuum cavitational cleaning process, VCS

Document Type

Conference Proceeding

Date of Original Version

12-1-2006

Abstract

The microelectronic industry is facing a multitude of challenges regarding device cleaning. New challenges include increasingly delicate features, tighter offsets and the removal of lead free compounds. The standard for wet cleaning has been atmospheric immersion and or spray cleaning using an appropriate chemistry. In certain cases acoustic energy is applied to aid in the removal particles and contaminates. The effectiveness of these techniques is now in question. Vacuum Cavitational Streaming (VCS™) offers an alternative non damaging cleaning and drying method for microelectronic devices. Recent testing has shown high efficiency removal of .15 to .01 micron particulate contaminate from planar, via and porous part surfaces. With VCS. a sequence of pressure modulation causes bubbles to grow on nucleation sites (particles-contaniinates- imperfections). As the vacuum pressure modulates the cavitation stream of bubble growing and imploding release their stored energy directly onto the nucleation sites, disrupting the boundary layer. This continuous tormenting of the boundary layer forces the release of particulates and contaminates. VCS continues until the desired level of cleanliness is achieved. Damage to surfaces is highly unlikely because of these natural principles of controlled "nucleation boiling." VCS provides direct energy transfer nucleation sites, making difficult to reach areas such as porous surfaces, vias. tight off devices and patterned surfaces no challenge for this unique Technology. VCS takes place in a modulated vacuum, perfect for cleaning oxide-forming materials such as low-k copper. VCS cleaning is integrated with vacuum drying within a single vacuum chamber, where the environment is controlled and managed to achieve previously unobtainable sub-micron cleaning and drying performance. Copyright © 2006 IMAPS.

Publication Title

Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

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