A mechanical reliability approach for the optimization of alternatives to tin-lead solder interconnection systems for electronic packaging
A methodology for evaluating suitable alternative materials to traditional tin-lead solder, as an electronic component interconnection media, is presented. The research addresses the mechanical reliability of all materials using approaches and methods which, beforehand, were unique to tin-lead solder. Included in the research is a tabulation of basic mechanical, fatigue, creep, and fracture mechanics properties.^ Basic mechanical data was acquired either through the literature or laboratory test. Fatigue data is limited to thermal shock/cycling. Creep data consists of observing material behavior under temperature only and also under thermo-mechanical conditions. The fracture mechanics study features the validation and subsequent use of the J-Integral as applied to solder and electrically conductive epoxies which are alternative candidates to the solder. Both types of materials are assumed to be elastic-plastic. Also, fracture behavior of a chip capacitor is modeled using the photoelastic stress analysis technique.^ In addition to the acquired data, the dissertation provides the framework for establishing a methodology for evaluating mechanical reliability of electronic interconnection media. ^
Engineering, Electronics and Electrical|Engineering, Mechanical|Engineering, Materials Science
Anthony Joseph Rafanelli,
"A mechanical reliability approach for the optimization of alternatives to tin-lead solder interconnection systems for electronic packaging"
Dissertations and Master's Theses (Campus Access).