Using the optical microscopy imaging method for studying electromigration
Abstract
Electromigration is a microscopic phenomenon involving electric field-induced diffusion, which is very relevant to damage in interconnects. A common method to monitor interconnect degradation is through electrical resistance measurements, which requires direct electrical contacts. It is desirable to develop non-contact methods to monitor electromigration damage formation. In this thesis, we propose a novel Optical Microscopy Imaging Method (OMIM), and we provide a theoretical description and experimental results. OMIM not only provides a new method for studying electromigration, but also provides a useful method for studying other micro-devices and materials in a non-contact mode. ^
Subject Area
Physics, Condensed Matter
Recommended Citation
Linghong Li,
"Using the optical microscopy imaging method for studying electromigration"
(2005).
Dissertations and Master's Theses (Campus Access).
Paper AAI3186910.
http://digitalcommons.uri.edu/dissertations/AAI3186910